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Feb 4, 2025
Signal Edge Solutions Founder Wins Engineer of the Year Award at DesignCon 2025
Baltimore, Maryland, February 4, 2025 – Signal Edge Solutions (SES), a cutting-edge provider of simulation, modeling, and measurement solutions, is proud to announce that Founder, CEO, and Chief Technologist Benjamin Dannan has won the prestigious DesignCon 2025 Engineer of the Year Award.
This award recognizes the best of the best in engineering and new product advancements at the chip, board, or system level. Finalists are selected by industry leaders based on the leadership, creativity, and out-of-the-box thinking that they bring to design, testing, and measurement in the fields of signal and power integrity. The winner is then selected by a peer vote.
Dannan, a senior member of the IEEE, was presented with the award on Thursday, January 30, in a ceremony before his peers at DesignCon 2025. “It is an honor,” he said, “I am standing on the shoulders of the great engineers that came before me, and I hope to pay it forward.”
Dannan’s innovative mindset and profound knowledge of signal and power integrity principles led him to found Signal Edge Solutions, which aims to bridge a gap in the SI/PI field by offering highly advanced products as well as high-speed measurement, measurement-based modeling, and electromagnetic (EM) modeling services tailored for various applications, including ASIC, package, and printed circuit board (PCB) design.
About Signal Edge Solutions, LLC
Signal Edge Solutions, LLC (https://www.signaledgesolutions.com/) was founded on the belief that there is a significant gap in the signal integrity and power integrity (SI/PI) fields. Signal Edge Solutions is addressing this gap by providing highly advanced services and products that focus on high-speed measurement, measurement-based modeling, and electromagnetic (EM) modeling services tailored to ASIC, package, and printed circuit board (PCB) design, in addition to other specialized engineering consulting services, which includes EMC testing, ASIC package design, chiplet package design, end-to-end SI/PI simulation modeling of complex ASICs and FPGA designs.
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